Patent Assignment Details
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Reel/Frame: | 016639/0223 | |
| Pages: | 2 |
| | Recorded: | 08/16/2005 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/17/2008
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Application #:
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11196338
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Filing Dt:
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08/04/2005
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Publication #:
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Pub Dt:
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02/08/2007
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Title:
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STRUCTURE AND METHOD OF FORMING A SEMICONDUCTOR MATERIAL WAFER
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Assignee
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818 GUOSHOUJING ROAD |
ZHANGJIANG HI-TECH PARK |
SHANGHAI 201203, CHINA |
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Correspondence name and address
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ROSENBERG, KLEIN & LEE
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3458 ELLICOTT CENTER DRIVE-SUITE 101
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ELLICOTT CITY, MD 21043
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