Patent Assignment Details
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| Reel/Frame: | 006927/0227 | |
| Pages: | 3 |
| | Recorded: | 03/22/1994 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/13/1995
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Application #:
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08215815
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Filing Dt:
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03/22/1994
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Title:
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MANUFACTURING METHOD OF ENCAPSULATING SEMICONDUCTOR DEVICE USING TWO RESIN SHEETS HAVING CONVEX PORTIONS
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Assignee
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| 72 HORIKAWA-CHO, SAIWAI-KU |
| KAWASAKI-SHI, JAPAN |
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Correspondence name and address
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FINNEGAN, HENDERSON, FARABOW, GARRETT &
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DUNNER - JOHN B. TURNER
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MANAGER, FILING AND PROSECUTION DEPT.
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1300 I STREET, N.W.
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WASHINGTON, D.C. 20005
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