Patent Assignment Details
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| Reel/Frame: | 012575/0227 | |
| Pages: | 6 |
| | Recorded: | 02/05/2002 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/17/2004
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Application #:
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10068165
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Filing Dt:
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02/05/2002
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Publication #:
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Pub Dt:
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08/07/2003
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Title:
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BOC BGA PACKAGE FOR DIE WITH I-SHAPED BOND PAD LAYOUT
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Assignee
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| 8000 S. FEDERAL WAY |
| BOISE, IDAHO 83706 |
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Correspondence name and address
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WHYTE HIRSCHBOECK DUDEK S.C.
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KRISTINE M. STRODTHOFF
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111 EAST WISCONSIN AVENUE, SUITE 2100
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MILWAUKEE, WI 53202
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