Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 027608/0228 | |
| Pages: | 5 |
| | Recorded: | 01/27/2012 | | |
| Attorney Dkt #: | 92,000-231 (RH-1127) |
| Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE APPLICATION NUMBER FOR 13/200,161. PREVIOUSLY RECORDED ON REEL 027307 FRAME 0839. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT OF APPLICATION # 13/200,161 TO RICHTEK TECHNOLOGY CORPORATION, R.O.C.. |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13200161
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Filing Dt:
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09/20/2011
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Publication #:
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Pub Dt:
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11/01/2012
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Title:
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Integrated circuit chip package and manufacturing method thereof
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Assignee
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| 5F, NO. 20, TAI YUEN STREET |
| CHUPEI CITY, HSIN-CHU, TAIWAN |
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Correspondence name and address
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RANDY W. TUNG, TUNG & ASSOCIATES
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838 W LONG LAKE ROAD
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SUITE 120
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BLOOMFIELD HILLS, MI 48302
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