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Patent Assignment Details
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Reel/Frame:008204/0231   Pages: 9
Recorded: 10/28/1996
Conveyance: MERGER (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
02/04/1997
Application #:
08410176
Filing Dt:
03/24/1995
Title:
SUB-MICRON DIFFUSION AREA ISOLATION WITH SI-SEG FOR A DRAM ARRAY
Assignor
1
Exec Dt:
10/28/1994
Assignee
1
PATENT DEPARTMENT, MAIL STOP 525
8000 S. FEDERAL WAY
BOISE, IDAHO 83706
Correspondence name and address
DAVID J. PAUL
PATENT DEPARTMENT, MAIL STOP 525
8000 S. FEDERAL WAY
BOISE, ID 83706

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