Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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Reel/Frame: | 065016/0232 | |
| Pages: | 2 |
| | Recorded: | 09/21/2023 | | |
Attorney Dkt #: | ZHZFY-23002-USPT |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/09/2024
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Application #:
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18370897
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Filing Dt:
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09/21/2023
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Publication #:
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Pub Dt:
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03/21/2024
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Title:
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Packaging Structure and Method of MEMS Pressure Sensor
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Assignee
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100 DICUI ROAD, BINHU DISTRICT |
WUXI, JIANGSU, CHINA 214000 |
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Correspondence name and address
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BYIP LTD.
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5465 LEGACY DRIVE, SUITE 650
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PLANO, TX 75024
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Search Results as of:
05/30/2024 07:58 AM
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