Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 021155/0235 | |
| Pages: | 4 |
| | Recorded: | 06/26/2008 | | |
| Attorney Dkt #: | Q108902 (SXL) |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12146621
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Filing Dt:
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06/26/2008
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Publication #:
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Pub Dt:
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01/01/2009
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Title:
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Resin Composition For Printed Circuit Board And Composite Substrate And Copper Laminates Using The Same
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Assignee
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| DOOSAN TOWER 18F, 18-12, ULCHI-RO 6KA CHUNG-GU |
| SEOUL, KOREA, DEMOCRATIC PEOPLE'S REPUBLIC OF 100-730 |
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Correspondence name and address
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SUGHRUE MION PLLC
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2100 PENNSYLVANIA AVE., N.W. #800
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WASHINGTON, DC 20037-3213
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