Patent Assignment Details
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| Reel/Frame: | 016510/0236 | |
| Pages: | 3 |
| | Recorded: | 07/12/2005 | | |
| Attorney Dkt #: | 9898-411 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11130586
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Filing Dt:
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05/16/2005
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Publication #:
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Pub Dt:
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11/24/2005
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Title:
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Chip package, image sensor module including chip package, and manufacturing method thereof
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Assignee
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| 416 MAETAN-DONG, YEONGTONG-GU |
| SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF |
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Correspondence name and address
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MARGER JOHNSON & MCCOLLOM, P.C.
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1030 S.W. MORRISON STREET
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PORTLAND, OREGON 97205
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05/30/2024 02:07 PM
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