Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 066019/0236 | |
| Pages: | 6 |
| | Recorded: | 10/20/2023 | | |
| Attorney Dkt #: | 814063.432; 439; 457* |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
4
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18158986
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Filing Dt:
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01/24/2023
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Publication #:
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Pub Dt:
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08/03/2023
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Title:
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ENHANCEMENT-MODE HEMT AND MANUFACTURING PROCESS OF THE SAME
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18167623
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Filing Dt:
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02/10/2023
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Publication #:
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Pub Dt:
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08/17/2023
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Title:
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HEMT DEVICE HAVING LOW CONDUCTION LOSSES AND MANUFACTURING PROCESS THEREOF
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18180680
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Filing Dt:
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03/08/2023
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Publication #:
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Pub Dt:
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09/21/2023
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Title:
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FORMING AN ELECTRONIC DEVICE, SUCH AS A JBS OR MPS DIODE, BASED ON 3C-SIC, AND 3C-SIC ELECTRONIC DEVICE
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18183866
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Filing Dt:
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03/14/2023
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Publication #:
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Pub Dt:
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09/21/2023
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Title:
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FORMING AN ELECTRONIC DEVICE, SUCH AS A JBS OR MPS DIODE, BASED ON 3C-SIC, AND 3C-SIC ELECTRONIC DEVICE
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Assignee
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| VIA C. OLIVETTI, 2 |
| AGRATE BRIANZA, ITALY 20864 |
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Correspondence name and address
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HAYLEY J. TALBERT
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701 FIFTH AVENUE, SUITE 5400
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SEED IP LAW GROUP LLP
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SEATTLE, WA 98104
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