Patent Assignment Details
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| Reel/Frame: | 014228/0237 | |
| Pages: | 3 |
| | Recorded: | 04/04/2003 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10381740
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Filing Dt:
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04/04/2003
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Publication #:
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Pub Dt:
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02/05/2004
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Title:
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Stacked wafer alignment method
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Assignee
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| 3-3, NAKANOSHIMA 3-CHOME |
| KITA-KU, OSAKA-SHI, OSAKA, JAPAN 530-0005 |
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Correspondence name and address
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SMITH PATENT OFFICE
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RANDOLPH A. SMITH
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1901 PENNSYLVANIA AVENUE, N.W.
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SUITE 200
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WASHINGTON, D.C. 20006-3433
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