Patent Assignment Details
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| Reel/Frame: | 007229/0238 | |
| Pages: | 2 |
| | Recorded: | 11/29/1994 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/28/1995
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Application #:
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08230768
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Filing Dt:
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04/21/1994
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Title:
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METHOD FOR MAKING CIRCULAR DIODE CHIPS THROUGH GLASS PASSIVATION
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Assignee
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| 1F., NO 54-1, AN FENG RD. |
| HSIN TIEN SHIH, TAIPEI |
| TAIWAN, CHINA |
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Correspondence name and address
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JOHN C. HOLMAN
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JACOBSON, PRICE, HOLMAN ET AL.
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400 7TH STREET, N.W.
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WASHINGTON, DC 20004
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