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Reel/Frame:	039439/0240			Pages:	5
		Recorded:	07/22/2016
Attorney Dkt #:	70027
Conveyance:	CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).

Total properties: 17

Patent #:	NONE	Issue Dt:		Application #:	13163523	Filing Dt:	06/17/2011
Publication #:	US20120319295	Pub Dt:	12/20/2012
Title:	INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PADS AND METHOD OF MANUFACTURE THEREOF

Patent #:	9530753	Issue Dt:	12/27/2016	Application #:	13243474	Filing Dt:	09/23/2011
Publication #:	US20130075915	Pub Dt:	03/28/2013
Title:	INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CHIP STACKING AND METHOD OF MANUFACTURE THEREOF

Patent #:	NONE	Issue Dt:		Application #:	13243555	Filing Dt:	09/23/2011
Publication #:	US20130075923	Pub Dt:	03/28/2013
Title:	INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ENCAPSULATION AND METHOD OF MANUFACTURE THEREOF

Patent #:	9576873	Issue Dt:	02/21/2017	Application #:	13325881	Filing Dt:	12/14/2011
Publication #:	US20130154105	Pub Dt:	06/20/2013
Title:	INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ROUTABLE TRACE AND METHOD OF MANUFACTURE THEREOF

Patent #:	9748203	Issue Dt:	08/29/2017	Application #:	13327609	Filing Dt:	12/15/2011
Publication #:	US20130154092	Pub Dt:	06/20/2013
Title:	INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CONDUCTIVE PILLARS AND METHOD OF MANUFACTURE THEREOF

Patent #:	NONE	Issue Dt:		Application #:	13366768	Filing Dt:	02/06/2012
Publication #:	US20120205811	Pub Dt:	08/16/2012
Title:	INTEGRATED CIRCUIT PACKAGING SYSTEM WITH TERMINAL LOCKS AND METHOD OF MANUFACTURE THEREOF

Patent #:	9768102	Issue Dt:	09/19/2017	Application #:	13425768	Filing Dt:	03/21/2012
Publication #:	US20130249078	Pub Dt:	09/26/2013
Title:	INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SUPPORT STRUCTURE AND METHOD OF MANUFACTURE THEREOF

Patent #:	NONE	Issue Dt:		Application #:	13427221	Filing Dt:	03/22/2012
Publication #:	US20130249073	Pub Dt:	09/26/2013
Title:	INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SUPPORT STRUCTURE AND METHOD OF MANUFACTURE THEREOF

Patent #:	9799589	Issue Dt:	10/24/2017	Application #:	13428251	Filing Dt:	03/23/2012
Publication #:	US20130249118	Pub Dt:	09/26/2013
Title:	INTEGRATED CIRCUIT PACKAGING SYSTEM WITH A GRID ARRAY WITH A LEADFRAME AND METHOD OF MANUFACTURE THEREOF

Patent #:	NONE	Issue Dt:		Application #:	13494721	Filing Dt:	06/12/2012
Publication #:	US20130328220	Pub Dt:	12/12/2013
Title:	INTEGRATED CIRCUIT PACKAGING SYSTEM WITH FILM ASSIST AND METHOD OF MANUFACTURE THEREOF

Patent #:	NONE	Issue Dt:		Application #:	13714815	Filing Dt:	12/14/2012
Publication #:	US20140165389	Pub Dt:	06/19/2014
Title:	INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ROUTABLE GRID ARRAY LEAD FRAME

Patent #:	9607938	Issue Dt:	03/28/2017	Application #:	13928754	Filing Dt:	06/27/2013
Publication #:	US20150001705	Pub Dt:	01/01/2015
Title:	INTEGRATED CIRCUIT PACKAGING SYSTEM WITH EMBEDDED PAD ON LAYERED SUBSTRATE AND METHOD OF MANUFACTURE THEREOF

Patent #:	NONE	Issue Dt:		Application #:	14136274	Filing Dt:	12/20/2013
Publication #:	US20150179602	Pub Dt:	06/25/2015
Title:	INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CONDUCTIVE INK AND METHOD OF MANUFACTURE THEREOF

Patent #:	NONE	Issue Dt:		Application #:	14136513	Filing Dt:	12/20/2013
Publication #:	US20150179555	Pub Dt:	06/25/2015
Title:	INTEGRATED CIRCUIT PACKAGING SYSTEM WITH VIALESS SUBSTRATE AND METHOD OF MANUFACTURE THEREOF

Patent #:	NONE	Issue Dt:		Application #:	14696741	Filing Dt:	04/27/2015
Publication #:	US20150318259	Pub Dt:	11/05/2015
Title:	INTEGRATED CIRCUIT PACKAGING SYSTEM WITH NO-REFLOW CONNECTION AND METHOD OF MANUFACTURE THEREOF

Patent #:	9859200	Issue Dt:	01/02/2018	Application #:	14792447	Filing Dt:	07/06/2015
Publication #:	US20160190054	Pub Dt:	06/30/2016
Title:	INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERPOSER SUPPORT STRUCTURE MECHANISM AND METHOD OF MANUFACTURE THEREOF

Patent #:	NONE	Issue Dt:		Application #:	14980292	Filing Dt:	12/28/2015
Publication #:	US20160190056	Pub Dt:	06/30/2016
Title:	INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE-ON-PACKAGE MECHANISM AND METHOD OF MANUFACTURE THEREOF

Assignor

Exec Dt:

03/29/2016

Assignee

10 ANG MO KIO STREET 65

#04-08/09 TECHPOINT

SINGAPORE, SINGAPORE 569059

Correspondence name and address
	WONG & REES LLP
	4677 OLD IRONSIDES DRIVE
	SUITE 370
	SANTA CLARA, CA 95054

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