Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 051013/0240 | |
| Pages: | 5 |
| | Recorded: | 11/14/2019 | | |
| Attorney Dkt #: | AB4724-US|ALTR:0450 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/05/2021
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Application #:
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16456647
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Filing Dt:
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06/28/2019
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Publication #:
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Pub Dt:
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10/24/2019
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Title:
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Fabric Die to Fabric Die Interconnect for Modularized Integrated Circuit Devices
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Assignee
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| 2200 MISSION COLLEGE BOULEVARD |
| SANTA CLARA, CALIFORNIA 95054 |
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Correspondence name and address
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INTEL CORPORATION C/O FLETCHER YODER PC
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P.O.BOX 692289
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HOUSTON, TX 77269-2289
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05/23/2024 03:10 PM
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