Patent Assignment Details
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| Reel/Frame: | 014890/0241 | |
| Pages: | 3 |
| | Recorded: | 01/20/2004 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/12/2005
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Application #:
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10660299
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Filing Dt:
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09/11/2003
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Publication #:
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Pub Dt:
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07/01/2004
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Title:
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METHOD FOR FABRICATING CONTACT PAD OF SEMICONDUCTOR DEVICE
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Assignee
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| SAN 136-1, AMI-RI |
| BUBAL-EUB, ICHON-SHI |
| KYOUNGKI-DO, KOREA, REPUBLIC OF 467-860 |
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Correspondence name and address
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MICHAEL R. HULL
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6300 SEARS TOWER
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233 S. WACKER DRIVE
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CHICAGO, IL 60606-6357
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