Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 061674/0241 | |
| Pages: | 9 |
| | Recorded: | 11/07/2022 | | |
| Attorney Dkt #: | AD7425-US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17555340
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Filing Dt:
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12/17/2021
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Publication #:
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Pub Dt:
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04/14/2022
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Title:
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BALL GRID ARRAY CHIP (BGA) PACKAGE COOLING ASSEMBLY WITH BOLSTER PLATE
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Assignee
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| 2200 MISSION COLLEGE BOULEVARD |
| SANTA CLARA, CALIFORNIA 95054 |
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Correspondence name and address
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HANLEY, FLIGHT & ZIMMERMAN, LLC
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150 S. WACKER DR.
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SUITE 2200
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CHICAGO, IL 60606
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05/29/2024 10:44 AM
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