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Reel/Frame:026636/0242   Pages: 3
Recorded: 07/22/2011
Attorney Dkt #:T5057-B505
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
12/30/2014
Application #:
13189108
Filing Dt:
07/22/2011
Publication #:
Pub Dt:
01/24/2013
Title:
METHOD OF FABRICATING AN INTEGRATED CIRCUIT DEVICE
Assignors
1
Exec Dt:
07/07/2011
2
Exec Dt:
07/14/2011
3
Exec Dt:
07/18/2011
4
Exec Dt:
07/14/2011
5
Exec Dt:
07/07/2011
6
Exec Dt:
07/18/2011
Assignee
1
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300
Correspondence name and address
LOWE HAUPTMAN HAM & BERNER, LLP (TSMC)
1700 DIAGONAL ROAD, SUITE 300
ALEXANDRIA, VA 22314

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