Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 027317/0243 | |
| Pages: | 14 |
| | Recorded: | 12/02/2011 | | |
| Attorney Dkt #: | 08-SIN-033 |
| Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE PREVIOUSLY RECORDED ON REEL 023365 FRAME 0789. ASSIGNOR(S) HEREBY CONFIRMS THE STMICROELECTRONICS ASIA PACIFIC PTE LTD SHOULD BE STMICROELECTRONICS PTE LTD. |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12578382
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Filing Dt:
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10/13/2009
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Publication #:
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Pub Dt:
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07/29/2010
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Title:
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INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING THE SAME
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Assignee
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| 28 ANG MO KIO INDUSTRIAL PARK 2 |
| SINGAPORE, SINGAPORE 569508 |
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Correspondence name and address
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HOGAN LOVELLS US LLP
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TWO NORTH CASCADE AVENUE, SUITE 1300
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COLORADO SPRINGS, CO 80903
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