Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 061379/0244 | |
| Pages: | 13 |
| | Recorded: | 10/11/2022 | | |
| Attorney Dkt #: | AE6385-US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17932624
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Filing Dt:
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09/15/2022
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Publication #:
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Pub Dt:
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03/21/2024
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Title:
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MICROELECTRONIC ASSEMBLIES WITH MIXED COPPER AND SOLDER INTERCONNECTS HAVING DIFFERENT THICKNESSES
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Assignee
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| 2200 MISSION COLLEGE BOULEVARD |
| SANTA CLARA, CALIFORNIA 95054 |
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Correspondence name and address
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ALISHA FEUSTEL
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4757 W PARK BLVD, STE 113-1026
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AKONA IP
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PLANO, TX 75093
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06/04/2024 08:44 PM
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