Patent Assignment Details
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| Reel/Frame: | 011589/0246 | |
| Pages: | 4 |
| | Recorded: | 03/08/2001 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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09800822
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Filing Dt:
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03/08/2001
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Publication #:
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Pub Dt:
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09/12/2002
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Title:
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Ball grid array semiconductor package structure adapted to attach to a pcb to avoid electromagnetic interference
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Assignee
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| 26, CHIN 3RD RD., 811 NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG |
| TAIWAN, CHINA |
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Correspondence name and address
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NIXON PEABODY LLP
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STUART J. FRIEDMAN
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8180 GREENSBORO DRIVE, SUITE 800
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MCLEAN, VIRGINIA 22102
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