Patent Assignment Details
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| Reel/Frame: | 023514/0246 | |
| Pages: | 5 |
| | Recorded: | 11/13/2009 | | |
| Attorney Dkt #: | 2515.0219 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/15/2015
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Application #:
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12617877
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Filing Dt:
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11/13/2009
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Publication #:
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Pub Dt:
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05/19/2011
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Title:
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Method of Forming Protective Material Between Semiconductor Die Stacked on Semiconductor Wafer to Reduce Defects During Singulation
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Assignee
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| 10 ANG MO KIO STREET 65 |
| #05-17/20 TECHPOINT |
| SINGAPORE, SINGAPORE 569059 |
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Correspondence name and address
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ROBERT D. ATKINS
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605 W. KNOX ROAD
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SUITE 104
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TEMPE, AZ 85284
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