Patent Assignment Details
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| Reel/Frame: | 032773/0246 | |
| Pages: | 3 |
| | Recorded: | 04/29/2014 | | |
| Attorney Dkt #: | TWT03246/US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/26/2014
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Application #:
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14259166
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Filing Dt:
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04/23/2014
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Publication #:
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Pub Dt:
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08/21/2014
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Title:
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SEMICONDUCTOR CHIP PACKAGE STRUCTURE
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Assignee
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| NO.1127, HEPING RD., BADE CITY |
| TAOYUAN, TAIWAN 334 |
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Correspondence name and address
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CKC & PARTNERS CO., LTD.
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12TH FLOOR, RUTTONJEE HOUSE 11 DUDDELL
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STREET
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HONG KONG, HONG KONG
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