Patent Assignment Details
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Reel/Frame: | 046233/0250 | |
| Pages: | 2 |
| | Recorded: | 06/28/2018 | | |
Attorney Dkt #: | 2602.1002 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/18/2020
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Application #:
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16019014
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Filing Dt:
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06/26/2018
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Publication #:
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Pub Dt:
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02/21/2019
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Title:
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SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SOLDERING SUPPORT JIG
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Assignee
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1-1 TANABESHINDEN, KAWASAKI-KU |
KAWASAKI-SHI, KANAGAWA, JAPAN 210-9530 |
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Correspondence name and address
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STAAS AND HALSEY LLP
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1201 NEW YORK AVE NW
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7TH FLOOR
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WASHINGTON, DC 20005
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