Patent Assignment Details
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| Reel/Frame: | 020384/0251 | |
| Pages: | 3 |
| | Recorded: | 01/08/2008 | | |
| Attorney Dkt #: | 1954.1055 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12007243
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Filing Dt:
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01/08/2008
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Publication #:
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Pub Dt:
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10/23/2008
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Title:
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Method of manufacturing printed circuit board for semiconductor package
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Assignee
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| 314, MAETAN 3-DONG, YEONGTONG-GU, SUWON |
| GYUNGGI-DO 443-743, KOREA, REPUBLIC OF |
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Correspondence name and address
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STAAS & HALSEY LLP
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ATTENTION: DAVID M. PITCHER
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1201 NEW YORK AVE., N.W., SUITE 700
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WASHINGTON, D.C. 20005
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