Patent Assignment Details
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| Reel/Frame: | 038114/0253 | |
| Pages: | 6 |
| | Recorded: | 03/28/2016 | | |
| Attorney Dkt #: | GE-08122 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/23/2017
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Application #:
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15082576
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Filing Dt:
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03/28/2016
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Title:
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INTEGRATION OF CHIP LEVEL MICRO-FLUIDIC COOLING IN CHIP PACKAGES FOR HEAT FLUX REMOVAL
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Assignee
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| 6801 ROCKLEDGE DRIVE |
| BETHESDA, MARYLAND 20817 |
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Correspondence name and address
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HOWARD IP LAW GROUP
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P.O. BOX 226
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FORT WASHINGTON, PA 19034
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05/31/2024 04:50 AM
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