Patent Assignment Details
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Reel/Frame: | 044407/0255 | |
| Pages: | 3 |
| | Recorded: | 12/15/2017 | | |
Attorney Dkt #: | P/4076-420 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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15822697
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Filing Dt:
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11/27/2017
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Publication #:
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Pub Dt:
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05/30/2019
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Title:
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PREMOLDED SUBSTRATE FOR MOUNTING A SEMICONDUCTOR DIE AND A METHOD OF FABRICATION THEREOF
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Assignee
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2 YISHUN AVENUE 7 |
SINGAPORE, SINGAPORE 768924 |
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Correspondence name and address
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OSTROLENK FABER LLP
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1180 AVENUE OF THE AMERICAS
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NEW YORK, NY 10036
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