Patent Assignment Details
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| Reel/Frame: | 018510/0257 | |
| Pages: | 4 |
| | Recorded: | 11/03/2006 | | |
| Attorney Dkt #: | 0941-1775PUS1 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/09/2010
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Application #:
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11592220
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Filing Dt:
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11/03/2006
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Publication #:
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Pub Dt:
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05/29/2008
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Title:
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SOLDER BUMP STRUCTURE AND METHOD OF MANUFACTURING SAME
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Assignee
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| NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN ROC, 300-77 |
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Correspondence name and address
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JOE MCKINNEY MUNCY
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BIRCH, STEWART, KOLASCH & BIRCH, LLP
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8110 GATEHOUSE RD.
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SUITE 100 EAST, P.O. BOX 747
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FALLS CHURCH, VA 22040-0747
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