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Patent Assignment Details
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Reel/Frame:013911/0259   Pages: 7
Recorded: 08/25/2003
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
10420557
Filing Dt:
04/22/2003
Publication #:
Pub Dt:
02/26/2004
Title:
Method for processing a semiconductor wafer using double-side polishing
Assignors
1
Exec Dt:
07/07/2003
2
Exec Dt:
07/11/2003
3
Exec Dt:
08/01/2003
4
Exec Dt:
07/10/2003
Assignee
1
501 PEARL DRIVE
P.O. BOX 8
ST. PETERS, MISSOURI 63376
Correspondence name and address
SENNIGER, POWERS, LEAVITT & ROEDEL
RICHARD A. SCHUTH
ONE METROPOLITAN SQUARE
16TH FLOOR
ST. LOUIS, MO 63102

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