Patent Assignment Details
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| Reel/Frame: | 022096/0259 | |
| Pages: | 5 |
| | Recorded: | 01/09/2009 | | |
| Attorney Dkt #: | 81880.0167 |
| Conveyance: | RE-RECORD TO CORRECT THE ADDRESS OF THE ASSIGNEE, PREVIOUSLY RECORDED ON REEL 021871 FRAME 0453. |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/17/2015
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Application #:
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11816814
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Filing Dt:
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11/21/2008
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Publication #:
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Pub Dt:
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05/21/2009
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Title:
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Joined Assembly, Wafer Holding Assembly, Attaching Structure Thereof and Method for Processing Wafer
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Assignee
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| 6, TAKEDA TOBADONO-CHO, FUSHIMI-KU, |
| KYOTO-SHI, KYOTO 612-8501, JAPAN |
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Correspondence name and address
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LAWRENCE J. MCCLURE, ESQ.
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HOGAN & HARTSON L.L.P.
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1999 AVENUE OF THE STARS, SUITE 1400
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LOS ANGELES, CALIFORNIA 90067
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