Patent Assignment Details
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| Reel/Frame: | 043798/0259 | |
| Pages: | 6 |
| | Recorded: | 10/05/2017 | | |
| Attorney Dkt #: | 051583-0713 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/07/2017
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Application #:
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15061696
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Filing Dt:
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03/04/2016
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Publication #:
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Pub Dt:
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09/07/2017
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Title:
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METHODS FOR TOP-DOWN FABRICATION OF WAFER SCALE TMDC MONOLAYERS
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Assignee
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| 5801 SOUTH ELLIS AVENUE |
| CHICAGO, ILLINOIS 60637 |
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Correspondence name and address
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SHANTANU C. PATHAK, PH.D./FOLEY & LARDNER LLP
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3000 K STREET NW
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SUITE 600
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WASHINGTON, DC 20007
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