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Total properties:
13
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Patent #:
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Issue Dt:
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02/16/1993
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Application #:
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07806400
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Filing Dt:
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12/13/1991
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Title:
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SUBSTITUTED 3,4-POLYMETHYLENEDIOXYTHIOPHENES, AND POLYMERS AND ELECTRO RESPONSIVE DEVICES MADE THEREFROM
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Patent #:
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Issue Dt:
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03/28/1995
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Application #:
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08046299
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Filing Dt:
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04/15/1993
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Title:
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PROCESS FOR HIGH DENSITY INTERCONNECTION OF SUBSTRATES AND INTERGRATED CIRCUIT CHIPS CONTAINING SENSITIVE STRUCTURES
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Patent #:
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Issue Dt:
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10/25/1994
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Application #:
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08067157
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Filing Dt:
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05/26/1993
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Title:
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HERMETIC HIGH DENSITY INTERCONNECTED ELECTRONIC SYSTEM
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Patent #:
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Issue Dt:
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05/24/1994
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Application #:
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08073250
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Filing Dt:
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06/07/1993
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Title:
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HERMETICALLY PACKAGED HDI ELECTRONIC SYSTEM
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Patent #:
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Issue Dt:
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07/19/1994
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Application #:
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08082710
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Filing Dt:
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06/28/1993
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Title:
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METHOD FOR NATURAL LANGUAGE DATA PROCESSING USING MORPHOLOGICAL AND PART-OF-SPEECH INFORMATION
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Patent #:
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Issue Dt:
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10/04/1994
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Application #:
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08087433
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Filing Dt:
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07/09/1993
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Title:
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INTEGRAL POWER AND GROUND STRUCTURE FOR MULTI-CHIP MODULES
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Patent #:
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Issue Dt:
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10/11/1994
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Application #:
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08087434
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Filing Dt:
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07/09/1993
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Title:
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METHOD FOR FABRICATING AN INTEGRATED CIRCUIT MODULE
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Patent #:
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Issue Dt:
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12/06/1994
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Application #:
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08093167
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Filing Dt:
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07/19/1993
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Title:
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SIMULTANEOUS MULTIBEAM APPROACH FOR CANCELLING MULTIPLE MAINLOBE JAMMERS WHILE PRESERVING MONOPULSE ANGLE ESTIMATION ACCURACY ON MAINLOBE TARGETS
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Patent #:
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Issue Dt:
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07/19/1994
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Application #:
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08141460
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Filing Dt:
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10/25/1993
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Title:
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HIGH DENSITY INTERCONNECT STRUCTURE INCLUDING A CHAMBER
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Patent #:
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Issue Dt:
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01/10/1995
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Application #:
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08174922
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Filing Dt:
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12/29/1993
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Title:
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MULTI-TURN Z-FOLDABLE SECONDARY WINDING FOR A LOW-PROFILE, CONDUCTIVE FILM TRANSFORMER
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Patent #:
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Issue Dt:
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12/26/1995
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Application #:
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08240129
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Filing Dt:
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05/10/1994
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Title:
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TUNED SPLIT-STIRLING CRYOREFRIGERATOR
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Patent #:
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Issue Dt:
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03/05/1996
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Application #:
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08262181
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Filing Dt:
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06/20/1994
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Title:
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EMBEDDED SUBSTRATE FOR INTEGRATED CIRCUIT MODULES
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Patent #:
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Issue Dt:
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02/20/1996
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Application #:
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08265051
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Filing Dt:
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06/24/1994
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Title:
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METHOD FABRICATION ENCASED MOLDED MULTI-CHIP MODULE SUBSTRATE
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