Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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Reel/Frame: | 059531/0263 | |
| Pages: | 8 |
| | Recorded: | 04/07/2022 | | |
Attorney Dkt #: | 2101555/1173-756 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17656477
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Filing Dt:
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03/25/2022
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Publication #:
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Pub Dt:
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09/28/2023
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Title:
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PACKAGE SUBSTRATES EMPLOYING PAD METALLIZATION LAYER FOR INCREASED SIGNAL ROUTING CAPACITY, AND RELATED INTEGRATED CIRCUIT (IC) PACKAGES AND FABRICATION METHODS
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Assignee
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5775 MOREHOUSE DRIVE |
SAN DIEGO, CALIFORNIA 92121-1714 |
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Correspondence name and address
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W&T/QUALCOMM
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106 PINEDALE SPRINGS WAY
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CARY, NC 27511
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05/31/2024 06:42 AM
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