Patent Assignment Details
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Reel/Frame: | 031432/0270 | |
| Pages: | 8 |
| | Recorded: | 10/18/2013 | | |
Attorney Dkt #: | TSMCP326US |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/22/2015
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Application #:
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14057117
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Filing Dt:
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10/18/2013
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Publication #:
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Pub Dt:
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04/23/2015
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Title:
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INDIRECT PRINTING BUMPING METHOD FOR SOLDER BALL DEPOSITION
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Assignee
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NO. 8, LI-HSIN RD. 6 |
HSIN-CHU SCIENCE PARK |
HSIN-CHU, TAIWAN 300-77 |
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Correspondence name and address
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ESCHWEILER & ASSOCIATES, LLC.
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629 EUCLID AVENUE, SUITE 1000
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NATIONAL CITY BANK BUILDING
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CLEVELAND, OH 44114
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