Patent Assignment Details
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Reel/Frame: | 028015/0271 | |
| Pages: | 4 |
| | Recorded: | 04/09/2012 | | |
Attorney Dkt #: | STW000047US1 |
Conveyance: | CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/15/2012
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Application #:
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11912843
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Filing Dt:
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10/26/2007
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Publication #:
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Pub Dt:
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08/07/2008
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Title:
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INTEGRATED CIRCUIT ASSEMBLY WITH PASSIVE INTEGRATION SUBSTRATE FOR POWER AND GROUND LINE ROUTING ON TOP OF AN INTEGRATED CIRCUIT CHIP
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Assignee
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39 CHEMIN DU CHAMP-DES-FILLES 1228 PLAN-LES-OUATES |
GENEVA, SWITZERLAND |
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Correspondence name and address
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HOGAN LOVELLS US LLP
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TWO NORTH CASCADE AVENUE
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SUITE 1300
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COLORADO SPRINGS, CO 80903
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