Patent Assignment Details
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| Reel/Frame: | 005494/0272 | |
| Pages: | 3 |
| | Recorded: | 10/12/1990 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST. |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/20/1992
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Application #:
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07546963
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Filing Dt:
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07/02/1990
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Title:
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MULTIPLE LAMINATION HIGH DENSITY INTERCONNECT PROCESS AND STRUCTURE EMPLOYING THERMOPLASTIC ADHESIVES HAVING SEQUENTIALLY DECREASING TG'S
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Correspondence name and address
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ROBERT OCHIS
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GENERAL ELECTRIC COMPANY
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CRD PATENT DOCKET RM 4A59
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P.O. BOX 8, BLDG. K-1-SALAMONE
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SCHENECTADY, NY 12301
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