Patent Assignment Details
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| Reel/Frame: | 029561/0272 | |
| Pages: | 10 |
| | Recorded: | 01/02/2013 | | |
| Attorney Dkt #: | YPLMEC-PT003 |
| Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE ADDRESS PREVIOUSLY RECORDED ON REEL 029474 FRAME 0275. ASSIGNOR(S) HEREBY CONFIRMS THE CORRECTIVE ASSIGNMENT TO CORRECT ASSIGNEE'S ADDRESS FROM "DEMOCRATIC PEOPLE'S REPUBLIC OF KOREA" TO --REPUBLIC OF KOREA--. |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/06/2014
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Application #:
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13714200
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Filing Dt:
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12/13/2012
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Publication #:
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Pub Dt:
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07/11/2013
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Title:
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TIN-BASED SOLDER BALL AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
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Assignee
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| 316-2 GEUMEO-RI, POGOK-EUP, |
| CHEOIN-GU, YONGIN-SI |
| GYEONGGI-DO, KOREA, REPUBLIC OF 449-812 |
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Correspondence name and address
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YONG BEOM HWANG
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VOLPE AND KOENIG, P.C.
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30 S. 17TH STREET, UNITED PLAZA
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PHILADELPHIA, PA 19103
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