Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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Reel/Frame: | 020538/0273 | |
| Pages: | 3 |
| | Recorded: | 02/18/2008 | | |
Attorney Dkt #: | 5000-1-1101 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/08/2014
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Application #:
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12029502
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Filing Dt:
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02/12/2008
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Publication #:
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Pub Dt:
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08/14/2008
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Title:
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SEMICONDUCTOR DIE PACKAGE AND EMBEDDED PRINTED CIRCUIT BOARD
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Assignee
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416, MAETAN-DONG, YEONGTONG-GU |
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF |
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Correspondence name and address
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STEVE CHA
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CHA & REITER
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210 ROUTE 4 EAST
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SUITE #103
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PARAMUS, NJ 07652
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