Patent Assignment Details
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Reel/Frame: | 015222/0276 | |
| Pages: | 5 |
| | Recorded: | 10/06/2004 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/12/2008
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Application #:
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10891709
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Filing Dt:
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07/15/2004
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Title:
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INTEGRATED CIRCUIT PACKAGE WITH PARTIALLY EXPOSED CONTACT PADS AND PROCESS FOR FABRICATING THE SAME
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Assignee
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QPL INDUSTRIAL BUILDING, 14TH FLOOR |
138 TEXACO ROAD |
TSUEN WAN, NEW TERRITORIES, HONG KONG |
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Correspondence name and address
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KEATING & BENNETT LLP
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CHRISTOPHER A. BENNETT
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10400 EATON PLACE, SUITE 312
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FAIRFAX, VA 22030
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