Patent Assignment Details
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Reel/Frame: | 061763/0276 | |
| Pages: | 3 |
| | Recorded: | 11/14/2022 | | |
Attorney Dkt #: | P109774PCT-US |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/10/2023
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Application #:
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16603863
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Filing Dt:
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10/09/2019
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Publication #:
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Pub Dt:
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04/16/2020
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Title:
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DIELECTRIC FOR HIGH DENSITY SUBSTRATE INTERCONNECTS
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Assignee
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2200 MISSION COLLEGE BOULEVARD |
SANTA CLARA, CALIFORNIA 95054 |
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Correspondence name and address
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JUSTIN K. BRASK
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1211 SW 5TH AVENUE, STE. 1600
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PORTLAND, OR 97204
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10/31/2024 07:41 PM
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