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Patent Assignment Details

NOTE:Results display only for issued patents and published applications. For pending or abandoned applications please consult USPTO staff.

Total properties: 12

Patent #:	5056296	Issue Dt:	10/15/1991	Application #:	07502558	Filing Dt:	03/30/1990
Title:	ISO-THERMAL SEAL PROCESS FOR ELECTRONIC DEVICES

Patent #:	5572070	Issue Dt:	11/05/1996	Application #:	08383511	Filing Dt:	02/06/1995
Title:	INTEGRATED CIRCUIT PACKAGES WITH HEAT DISSIPATION FOR HIGH CURRENT LOAD

Patent #:	5706579	Issue Dt:	01/13/1998	Application #:	08631649	Filing Dt:	04/09/1996
Title:	METHOD OF ASSEMBLING INTERGRATED CIRCUIT PACKAGE

Patent #:	5816158	Issue Dt:	10/06/1998	Application #:	08952336	Filing Dt:	02/02/1998
Title:	INVERTED STAMPING PROCESS

Patent #:	6214152	Issue Dt:	04/10/2001	Application #:	09273608	Filing Dt:	03/22/1999
Title:	LEAD FRAME MOISTURE BARRIER FOR MOLDED PLASTIC ELECTRONIC PACKAGES

Patent #:	6511866	Issue Dt:	01/28/2003	Application #:	09904583	Filing Dt:	07/12/2001
Publication #:	US20030013234	Pub Dt:	01/16/2003
Title:	USE OF DIVERSE MATERIALS IN AIR-CAVITY PACKAGING OF ELECTRONIC DEVICES

Patent #:	8283769	Issue Dt:	10/09/2012	Application #:	12903734	Filing Dt:	10/13/2010
Publication #:	US20110084371	Pub Dt:	04/14/2011
Title:	MODULAR LOW STRESS PACKAGE TECHNOLOGY

Patent #:	8759965	Issue Dt:	06/24/2014	Application #:	12903752	Filing Dt:	10/13/2010
Publication #:	US20110084376	Pub Dt:	04/14/2011
Title:	MODULAR LOW STRESS PACKAGE TECHNOLOGY

Patent #:	8153474	Issue Dt:	04/10/2012	Application #:	12903761	Filing Dt:	10/13/2010
Publication #:	US20110086469	Pub Dt:	04/14/2011
Title:	MODULAR LOW STRESS PACKAGE TECHNOLOGY

Patent #:	8560104	Issue Dt:	10/15/2013	Application #:	12903772	Filing Dt:	10/13/2010
Publication #:	US20110087353	Pub Dt:	04/14/2011
Title:	MODULAR LOW STRESS PACKAGE TECHNOLOGY

Patent #:	8639373	Issue Dt:	01/28/2014	Application #:	12903779	Filing Dt:	10/13/2010
Publication #:	US20110087356	Pub Dt:	04/14/2011
Title:	MODULAR LOW STRESS PACKAGE TECHNOLOGY

Assignor

Exec Dt:

10/18/2012

Assignee

380 INTERLOCKEN CRESCENT, SUITE 600

BROOMFIELD, COLORADO 80021

Correspondence name and address
	BENJAMIN C. WILES
	TROUTMAN SANDERS LLP
	600 PEACHTREE STREET NE, SUITE 5200
	ATLANTA, GA 30308

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