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Patent Assignment Details
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Reel/Frame:020326/0280   Pages: 6
Recorded: 01/07/2008
Attorney Dkt #:07-879
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
11904277
Filing Dt:
09/20/2007
Publication #:
Pub Dt:
04/10/2008
Title:
Method to remove resist layers from a substrate
Assignors
1
Exec Dt:
11/15/2007
2
Exec Dt:
11/20/2007
3
Exec Dt:
11/15/2007
Assignee
1
75 KAPELDREEF
LEUVEN, BELGIUM 3001
Correspondence name and address
MCDONNELL BOEHNEN HULBERT&BERGHOFF LLP
300 S. WACKER DRIVE, SUITE 3100
CHICAGO, IL 60606-6709

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