Patent Assignment Details
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| Reel/Frame: | 055963/0280 | |
| Pages: | 5 |
| | Recorded: | 04/19/2021 | | |
| Attorney Dkt #: | 53EH-303347-US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/16/2024
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Application #:
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17234554
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Filing Dt:
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04/19/2021
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Publication #:
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Pub Dt:
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08/05/2021
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Title:
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THROUGH-SILICON VIA INTERCONNECTION STRUCTURE AND METHODS FOR FABRICATING SAME
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Assignee
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| NO. 388, XINGYE AVENUE, AIRPORT INDUSTRIAL PARK |
| ECONOMIC AND TECHNOLOGICAL DEVELOPMENT AREA |
| HEFEI, ANHUI, CHINA 230601 |
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Correspondence name and address
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SHEPPARD MULLIN RICHTER & HAMPTON LLP
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379 LYTTON AVE.
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ATTN: JING ZHENG
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PALO ALTO, CA 94301
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06/19/2024 08:58 AM
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