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Patent Assignment Details
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Reel/Frame:053791/0283   Pages: 9
Recorded: 09/16/2020
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 16
1
Patent #:
Issue Dt:
01/13/2015
Application #:
13543727
Filing Dt:
07/06/2012
Publication #:
Pub Dt:
05/30/2013
Title:
PLATE AND SHAFT DEVICE
2
Patent #:
Issue Dt:
07/29/2014
Application #:
13681875
Filing Dt:
11/20/2012
Publication #:
Pub Dt:
07/25/2013
Title:
Hermetically Joined Ceramic Assemblies And Low Temperature Method For Hermetically Joining Ceramic Materials
3
Patent #:
Issue Dt:
04/01/2014
Application #:
13681930
Filing Dt:
11/20/2012
Publication #:
Pub Dt:
07/18/2013
Title:
METHOD FOR HERMETICALLY JOINING PLATE AND SHAFT DEVICES INCLUDING CERAMIC MATERIALS USED IN SEMICONDUCTOR PROCESSING
4
Patent #:
Issue Dt:
01/31/2017
Application #:
13682171
Filing Dt:
11/20/2012
Publication #:
Pub Dt:
07/17/2014
Title:
Method For Manufacture Of A Multi-Layer Plate Device
5
Patent #:
Issue Dt:
04/19/2016
Application #:
13682225
Filing Dt:
11/20/2012
Publication #:
Pub Dt:
07/18/2013
Title:
MULTI-LAYER PLATE DEVICE
6
Patent #:
Issue Dt:
05/29/2018
Application #:
13831670
Filing Dt:
03/15/2013
Publication #:
Pub Dt:
01/16/2014
Title:
Multiple Zone Heater
7
Patent #:
Issue Dt:
04/18/2017
Application #:
14292804
Filing Dt:
05/30/2014
Publication #:
Pub Dt:
04/23/2015
Title:
Low Temperature Method For Hermetically Joining Non-Diffusing Ceramic Materials
8
Patent #:
Issue Dt:
12/11/2018
Application #:
14543376
Filing Dt:
11/17/2014
Publication #:
Pub Dt:
10/08/2015
Title:
HIGH SPEED LOW TEMPERATURE METHOD FOR MANUFACTURING AND REPAIRING SEMICONDUCTOR PROCESSING EQUIPMENT AND EQUIPMENT PRODUCED USING SAME
9
Patent #:
Issue Dt:
11/12/2019
Application #:
14977590
Filing Dt:
12/21/2015
Publication #:
Pub Dt:
06/30/2016
Title:
HIGH TEMPERATURE RESISTANT SILICON JOINT FOR THE JOINING OF CERAMICS
10
Patent #:
Issue Dt:
02/26/2019
Application #:
15065500
Filing Dt:
03/09/2016
Publication #:
Pub Dt:
02/09/2017
Title:
Multi-Layer Plate Device
11
Patent #:
Issue Dt:
06/19/2018
Application #:
15133934
Filing Dt:
04/20/2016
Publication #:
Pub Dt:
03/16/2017
Title:
METHOD FOR REPAIRING HEATERS AND CHUCKS USED IN SEMICONDUCTOR PROCESSING
12
Patent #:
Issue Dt:
03/17/2020
Application #:
15341843
Filing Dt:
11/02/2016
Publication #:
Pub Dt:
09/14/2017
Title:
Electrostatic Chuck For Clamping In High Temperature Semiconductor Processing And Method Of Making Same
13
Patent #:
Issue Dt:
05/12/2020
Application #:
15419952
Filing Dt:
01/30/2017
Publication #:
Pub Dt:
09/14/2017
Title:
Method For Manufacture Of A Multi-Layer Plate Device
14
Patent #:
Issue Dt:
11/23/2021
Application #:
16102737
Filing Dt:
08/14/2018
Publication #:
Pub Dt:
04/11/2019
Title:
Method For Joining Quartz Pieces And Quartz Electrodes And Other Devices Of Joined Quartz
15
Patent #:
Issue Dt:
01/25/2022
Application #:
16111148
Filing Dt:
08/23/2018
Publication #:
Pub Dt:
07/02/2020
Title:
Semiconductor Substrate Support With Multiple Electrodes And Method For Making Same
16
Patent #:
Issue Dt:
05/16/2023
Application #:
16203562
Filing Dt:
11/28/2018
Publication #:
Pub Dt:
09/26/2019
Title:
Semiconductor Processing Equipment With High Temperature Resistant Nickel Alloy Joints And Methods For Making Same
Assignor
1
Exec Dt:
08/07/2020
Assignee
1
12001 LACKLAND ROAD
ST. LOUIS, MISSOURI 63146
Correspondence name and address
BURRIS LAW, PLLC
300 RIVER PLACE DRIVE
SUITE 1775
DETROIT, MI 48207

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