Patent Assignment Details
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| Reel/Frame: | 065731/0284 | |
| Pages: | 4 |
| | Recorded: | 12/01/2023 | | |
| Attorney Dkt #: | 111P001146US.CIP |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18526100
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Filing Dt:
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12/01/2023
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Publication #:
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Pub Dt:
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04/25/2024
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Title:
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CHIP PACKAGE STRUCTURE AND METHOD FOR PRODUCING THE SAME
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Assignee
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| 6 F., NO. 83, YANPING S. RD., ZHONGZHENG DIST., |
| TAIPEI CITY, TAIWAN 10043 |
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Correspondence name and address
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LI & CAI INTELLECTUAL PROPERTY (USA) OFFICE
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3057 NUTLEY STREET
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SUITE 818
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FAIRFAX, VA 22031
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