Patent Assignment Details
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Reel/Frame: | 026545/0288 | |
| Pages: | 4 |
| | Recorded: | 06/29/2011 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
2
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Patent #:
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Issue Dt:
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10/08/2013
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Application #:
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12671993
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Filing Dt:
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07/16/2010
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Publication #:
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Pub Dt:
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10/13/2011
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Title:
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STACK PACKAGES USING RECONSTITUTED WAFERS
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Patent #:
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Issue Dt:
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06/18/2013
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Application #:
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12723039
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Filing Dt:
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03/12/2010
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Publication #:
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Pub Dt:
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09/16/2010
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Title:
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STACKED MICROELECTRONIC ASSEMBLIES HAVING VIAS EXTENDING THROUGH BOND PADS
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Assignee
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3025 ORCHARD PARKWAY |
SAN JOSE, CALIFORNIA 95134 |
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Correspondence name and address
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DARYL K. NEFF
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LERNER, DAVID, LITTENBERG, KRUMHOLZ & MENTLIK, LLP
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600 SOUTH AVENUE WEST
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WESTFIELD, NJ 07090
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