Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 044839/0293 | |
| Pages: | 3 |
| | Recorded: | 02/06/2018 | | |
| Attorney Dkt #: | 763P055 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
1
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/02/2022
|
Application #:
|
15888413
|
Filing Dt:
|
02/05/2018
|
|
Publication #:
|
|
Pub Dt:
|
08/09/2018
| | | | |
|
Title:
|
Surface-Treated Copper Foil, Copper Foil Having Carrier, Laminated Material, Method For Producing Printed Wiring Board, And Method For Producing Electronic Apparatus
|
|
|
Assignee
|
|
|
|
|
| 1-2, OTEMACHI 1-CHOME |
| CHIYODA-KU, TOKYO, JAPAN 1008164 |
|
|
Correspondence name and address
|
| |
NIELDS, LEMACK & FRAME, LLC
|
| |
176 E. MAISN STREET
|
| |
SUITE 5
|
| |
WESTBORO, MA 01581
|
Search Results as of:
06/06/2024 10:47 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
