Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 056947/0293 | |
| Pages: | 11 |
| | Recorded: | 07/22/2021 | | |
| Attorney Dkt #: | 1032341.006755 / 18-8645 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17425088
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Filing Dt:
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07/22/2021
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Publication #:
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Pub Dt:
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04/07/2022
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Title:
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SILICON CHIP HAVING MULTI-ZONE THROUGH SILICON VIAS AND METHOD OF MANUFACTURING THE SAME
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Assignee
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| 3600 CIVIC CENTER BOULEVARD |
| 9TH FLOOR |
| PHILADELPHIA, PENNSYLVANIA 19104 |
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Correspondence name and address
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BAKER & HOSTETLER LLP
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CIRA CENTRE 12TH FLOOR
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2929 ARCH STREET
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PHILADELPHIA, PA 19104-2891
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