Patent Assignment Details
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| Reel/Frame: | 061315/0293 | |
| Pages: | 6 |
| | Recorded: | 10/05/2022 | | |
| Attorney Dkt #: | 60483US01 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
3
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Patent #:
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Issue Dt:
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05/21/2019
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Application #:
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15148747
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Filing Dt:
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05/06/2016
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Publication #:
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Pub Dt:
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11/09/2017
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Title:
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SEMICONDUCTOR DEVICE UTILIZING AN ADHESIVE TO ATTACH AN UPPER PACKAGE TO A LOWER DIE
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Patent #:
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Issue Dt:
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05/18/2021
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Application #:
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16417918
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Filing Dt:
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05/21/2019
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Publication #:
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Pub Dt:
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02/06/2020
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Title:
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ELECTRONIC DEVICE HAVING A SUBSTRATE-TO-SUBSTRATE INTERCONNECTION STRUCTURE AND MANUFACTURING METHOD THEREOF
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Patent #:
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Issue Dt:
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01/09/2024
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Application #:
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17320759
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Filing Dt:
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05/14/2021
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Publication #:
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Pub Dt:
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10/07/2021
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Title:
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ELECTRONIC DEVICE HAVING A SUBSTRATE-TO-SUBSTRATE INTERCONNECTION STRUCTURE AND MANUFACTURING METHOD THEREOF
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Assignee
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| 2045 E. INNOVATION CIRCLE |
| TEMPE, ARIZONA 85284 |
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Correspondence name and address
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MCANDREWS, HELD & MALLOY, LTD.
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500 WEST MADISON STREET
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SUITE 3400
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CHICAGO, IL 60661
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