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Reel/Frame:015769/0294   Pages: 3
Recorded: 09/01/2004
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
11/07/2006
Application #:
10933912
Filing Dt:
09/01/2004
Publication #:
Pub Dt:
09/29/2005
Title:
MULTILAYER INTEGRATED CIRCUIT FOR RF COMMUNICATION AND METHOD FOR ASSEMBLY THEREOF
Assignors
1
Exec Dt:
09/01/2004
2
Exec Dt:
09/01/2004
Assignee
1
5 F EMERALD BUILDING
1364-29, SEOCHO-DONG, SEOCHO-GU,
SEOUL, 137-863, KOREA, REPUBLIC OF
Correspondence name and address
CARR & FERRELL LLP
ROBERT D. HAYDEN
2200 GENG ROAD
PALO ALTO, CA 94303

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