Patent Assignment Details
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| Reel/Frame: | 025582/0294 | |
| Pages: | 4 |
| | Recorded: | 01/04/2011 | | |
| Attorney Dkt #: | 29137.665.00 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/23/2017
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Application #:
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12989353
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Filing Dt:
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01/04/2011
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Publication #:
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Pub Dt:
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05/12/2011
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Title:
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EPOXY-BASED COMPOSITION, ADHESIVE FILM, DICING DIE-BONDING FILM AND SEMICONDUCTOR DEVICE
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Assignee
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| 20, YOIDO-DONG, YOUNGDUNGPO-GU |
| SEOUL, KOREA, DEMOCRATIC PEOPLE'S REPUBLIC OF 150-721 |
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Correspondence name and address
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MCKENNA LONG & ALDRIDGE LLP
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1900 K STREET, NW
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WASHINGTON, DC 20006
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