Patent Assignment Details
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| Reel/Frame: | 049902/0294 | |
| Pages: | 9 |
| | Recorded: | 07/30/2019 | | |
| Attorney Dkt #: | 023103.0203 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/02/2021
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Application #:
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16526020
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Filing Dt:
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07/30/2019
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Publication #:
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Pub Dt:
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10/01/2020
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Title:
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METHOD OF FORMING AND PACKAGING SEMICONDUCTOR DIE
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Assignee
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| 215, DAESIN-RO, HEUNGDEOK-GU |
| CHUNGCHEONGBUK-DO |
| CHEONGJU-SI, KOREA, REPUBLIC OF 28429 |
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Correspondence name and address
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NSIP LAW
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P.O. BOX 65745
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WASHINGTON, DC 20035
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05/25/2024 07:15 AM
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